Thick Film Ceramic Substrates Manufacturers Suppliers Exporters

BHOSCH ELECTRONICS APPLIED TECHNOLOGY PRIVATE LIMITED

About Us

BHOSCH Electronics Applied Technology (BEAT) has established state-of-the-art facilities for the manufacturing of ceramic substrate PCBs and a wide range of electronic packaging solutions. We support low-, medium-, and high-volume production of ceramic PCBs, die assembly, wire bonding, metal packaging, and epoxy encapsulation. Custom ceramic PCBs and package designs can be developed to meet specific customer requirements. BEAT is founded and managed by industry experts in electronic packaging with over 30 years of experience.

Activities

Manufacturer of Ceramic PCBs, Thick Film Ceramic Substrates, Thin Film Ceramic Substrates, DBC (Direct Bonded Copper) Substrates, LTCC Substrates, Hermetic Metal Packages, High Temperature PCB, High Thermal Conductivity PCB, Power Electronics PCB, Custom Ceramic PCB, High Voltage PCB, Core Services - Electronic Packaging Services, Microelectronics Assembly, Die Attach & Wire Bonding, Epoxy Encapsulation, Custom PCB Design, Testing Services - Electronic Components, Industrial Electronics, Microelectronics, Testing Services, PCB, Testing Jig Development, DBC Substrate,